The scholarship covers tuition fees and stipend of $28,056 per annum. The scholarship also covers OSHC insurance and return airfares.
|Value||Eligibility||Open date||Close date|
|Stipend covered by the Vingroup Scholarship Program (for up to 3.5 years)||
||See page for details||See page for details|
To apply please refer to the Vingroup website here.
This is a stipend scholarship and will be covered by the Vingroup Scholarship Program. It is tenable for 3.5 years.
Academic course fees are also provided for a successful international applicant, for 14 research periods, subject to satisfactory academic performance.
The USYD Vingroup scholarship is co-funded by Vingroup and the University of Sydney is available for outstanding Higher Degree by Research (HDR) students in the Faculty of Engineering and the Faculty of Science. The scholarship covers tuition fees and stipend at the RTP rate of $28, 056 per annum. The scholarship also covers OSHC insurance and return airfares.