Infrastructure_
Scanning electron microscopy
Capabilities in surface topography and composition analysis
Learn more about our scanning electron microscopes which can be utilised for a range of research and industrial applications.
Our facilities
- Schottky field-emission monochromated electron source for high resolution and high stability imaging
- Topographic imaging below 1nm resolution
- Stage biasing for low voltage imaging
- Wide array of detectors including, CBD, ABS and STEM.
- Multiple Plasma Ion source including Xe.Ar.N and O for high throughput milling and targeted ion solid interactions
- Multi gas injection and mixing systems with range of precursor gas options
- Integrated Oxford Instrument AZtec EDS and EBSD system, with X-Max 80mm2 SDD EDS detector, and high speed Symmetry EBSD detector
- Automated 3D imaging, EDS and EBSD mapping capability
- Easy lift micro manipulator for in-situ TEM and atom probe sample lift-out
- Schottky field emission gun (FEG) SEM for high resolution imaging
- Variable pressure (VP) capability enabling study of non-conductive material
- Equipped with Gatan 3view 2XP serial block face (SBF) SEM system, enabling fully automated serial sectioning through resin-embedded samples
- Dedicated low kV BSE detector providing TEM quality backscatter electron images, revealing cellular structures in a wide range of life-science samples
- Tomographic z-resolution <30nm using the 3view system
- Up to 32k x 24k pixel image collection
- This Sigma can also be fitted with a regular, motorised SEM stage for routine imaging of both bulk and electron transparent samples
- Compatible for use with correlative microscopy system, Shuttle and Find
- Schottky field emission gun (FEG) SEm for high resolution imaging
- Variable pressure (VP) capability enabling study of non-conductive material
- Dedicated low kV BSE detector providing TEM quality backscatter electron images, revealing cellular structures in a wide range of life-science samples
- STEM detector with brightfield and darkfield imaging
- Topographic imaging to ~1nm using an in-lens secondary electron detector
- Up to 8k resolution image collection
- Compatible for use with correlative microscopy system, Shuttle and Find
- Integrated Oxford instrument AZtec EDS and EBSD system, with X-Max 20mm2 SDD EDS detector and high speed Nordlys-F+ EBSD detector
- Compact tabletop SEM
- High quality imaging (both SE and BSE) of features down to sub-micron levels
- Equipped with tilt/rotate stage
- Low vacuum (LV) capability for imaging non-conductive material
- Fast training - normally completed in 1 hour
- Easy to use with a high throughput
- Schottky field-emission source for high resolution and beam current
- Exceptional low kV performance
- Topographic imaging to < 1nm using an in-lens secondary electron detector
- High-resolution orientation and strain imaging by AsB detector
- Nanoscale, high-sensitivity compositional imaging using EsB detector and limiting grid
- Charge compensator (gas injector) for imaging of non-conducting specimens
- Oxford Instruments AZtec integrated EDS and EBSD system, with X-Max 20mm2 silicon drift EDS detector and Symmetry CMOS EBSD detector, allowing 0.3ms per point acquisition
- Dedicated sample holders for transmission Kikuchi diffraction (TKD) analysis
- Oxford Instruments Layerprobe software for measuring thin film thicknesses and composition
- High-current mode for extended depth of field and EBSD
- STEM detector with brightfield and darkfield imaging
- Evactron on-chamber Plasma cleaner for removing carbon contamination.
- Zeiss EVO 50 SEM can be used for a range of imaging and analytical applications using either a W or LaB6 filament
- Large area BSE detector ideal for imaging mineralogical and metallurgical samples
- Oxford Instruments AZtec EDS system, with large area X-Max 80mm2 silicon drift EDS detector
- Fully automated analytical capability with particle detection ("Feature"), large area imaging and EDS map montaging
- Ideal for automated detection of inclusions in steel, heavy minerals in rocks and particle classification in engineering applications
- Multi sample stages (5 polished thin sections or 9 epoxy-mounted blocks)
- Schottky field-emission electron source for high resolution and high stability imaging
- Topographic imaging down to 1nm resolution
- Additional imaging with retractable BSE and STEM detectors
- High resolution Ga ion source (Cobra) with <2.5nm resolution
- Additional low kV FIB option, enabling high resolution milling below 5kV
- Multi and single gas injection systems with range of precursor gas options
- FIBICS advanced patterning software
- In-chamber Kleindiek micromanipulator system for in-situ TEM and atom probe sample lift-out
- Cryo stage and cryo UHV transfer system for cyro milling and vacuum transfer of APT samples
