Scanning electron microscopy

• Schottky field-emission monochromated electron source for high resolution and high stability imaging
• Topographic imaging below 1nm resolution
• Stage biasing for low voltage imaging
• Wide array of detectors including, CBD, ABS and STEM.
• Multiple Plasma Ion source including Xe.Ar.N and O for high throughput milling and targeted ion solid interactions
  
• Multi gas injection and mixing systems with range of precursor gas options
• Integrated Oxford Instrument AZtec EDS and EBSD system, with X-Max 80mm2 SDD EDS detector, and high speed Symmetry EBSD detector
• Automated 3D imaging, EDS and EBSD mapping capability
• Easy lift micro manipulator for in-situ TEM and atom probe sample lift-out

• Schottky field emission gun SEM for high resolution imaging
• Variable pressure capability enabling study of non-conductive material
• Gatan 3view 2XP serial block face SEM system, enabling fully automated serial sectioning through resin-embedded samples
• Low kV BSE detector providing TEM quality backscatter electron images, revealing cellular structures in a wide variety of life sciences samples
• Tomographic z-resolution <30nm using 3view system
  
• Up to 32k x 24k pixel image collection
• This instrument can be fitted with a regular, motorised SEM stage for routine imaging of both bulk and electron transparent samples
  
• Compatible with correlative microscopy system, Shuttle and Find

Specialist:
Dr Errin Johnson  (errin johnson@sydney.edu.au) (Bio)

• Schottky field emission gun (FEG) SEm for high resolution imaging
• Variable pressure (VP) capability enabling study of non-conductive material
• Dedicated low kV BSE detector providing TEM quality backscatter electron images, revealing cellular structures in a wide range of life-science samples
• STEM detector with brightfield and darkfield imaging
• Topographic imaging to ~1nm using an in-lens secondary electron detector
• Up to 8k resolution image collection
• Compatible for use with correlative microscopy system, Shuttle and Find
• Integrated Oxford instrument AZtec EDS and EBSD system, with X-Max 20mm2 SDD EDS detector and high speed Nordlys-F+ EBSD detector
  

• Compact tabletop SEM
• High quality imaging (both SE and BSE) of features down to sub-micron levels
• Equipped with tilt/rotate stage
• Low vacuum (LV) capability for imaging non-conductive material
• Fast training - normally completed in 1 hour
• Easy to use with a high throughput

• Schottky field-emission source for high resolution and beam current
• Exceptional low kV performance
• Topographic imaging to < 1nm using an in-lens secondary electron detector
• High-resolution orientation and strain imaging by AsB detector
• Nanoscale, high-sensitivity compositional imaging using EsB detector and limiting grid
• Charge compensator (gas injector) for imaging of non-conducting specimens
• Oxford Instruments AZtec integrated EDS and EBSD system, with X-Max 20mm2 silicon drift EDS detector and Symmetry CMOS EBSD detector, allowing 0.3ms per point acquisition
  
• Dedicated sample holders for transmission Kikuchi diffraction (TKD) analysis
• Oxford Instruments Layerprobe software for measuring thin film thicknesses and composition
• High-current mode for extended depth of field and EBSD
• STEM detector with brightfield and darkfield imaging
• Evactron on-chamber Plasma cleaner for removing carbon contamination.

• Zeiss EVO 50 SEM can be used for a range of imaging and analytical applications using either a W or LaB6 filament
• Large area BSE detector ideal for imaging mineralogical and metallurgical samples
• Oxford Instruments AZtec EDS system, with large area X-Max 80mm2 silicon drift EDS detector
• Fully automated analytical capability with particle detection ("Feature"), large area imaging and EDS map montaging
• Ideal for automated detection of inclusions in steel, heavy minerals in rocks and particle classification in engineering applications
• Multi sample stages (5 polished thin sections or 9 epoxy-mounted blocks)

• Schottky field-emission electron source for high resolution and high stability imaging
• Topographic imaging down to 1nm resolution
• Additional imaging with retractable BSE and STEM detectors
• High resolution Ga ion source (Cobra) with <2.5nm resolution
• Additional low kV FIB option, enabling high resolution milling below 5kV
• Multi and single gas injection systems with range of precursor gas options
• FIBICS advanced patterning software
• In-chamber Kleindiek micromanipulator system for in-situ TEM and atom probe sample lift-out
• Cryo stage and cryo UHV transfer system for cyro milling and vacuum transfer of APT samples